Place of Origin: Guangdong, China Material Introduction:This product is made from high-purity silicon carbide ceramic, designed for wafer adsorption, vacuum holding, and precision positioning in semiconductor handling equipment. Compared with general ceramic suction parts, this SiC vacuum chuck focuses more on surface flatness, dimensional stability, vacuum sealing performance, and clean process compatibility. Functional Features:The silicon carbide ceramic vacuum chuck provides stable wafer holding, good surface flatness, reliable dimensional accuracy, and strong resistance to heat, wear, and chemical corrosion. It is suitable for repeated wafer transfer and positioning processes where low contamination, stable adsorption, and accurate alignment are important. Application Industries:Mainly used in semiconductor ceramic parts, wafer transfer systems, vacuum chuck platforms, cleanroom automation equipment, LED manufacturing, solar cell production, microelectronics assembly, and other precision wafer handling applications. Delivery Time:Typical lead time depends on wafer size, chuck structure, flatness requirement, surface finish, vacuum groove or hole design, assembly method, and order quantity. Custom ceramic vacuum chucks can be evaluated according to drawings, samples, or equipment requirements before production.

Place of Origin: Guangdong, China Material Introduction:This product is made from high-purity porous silicon carbide ceramic, designed for stable vacuum adsorption and wafer handling applications. The controlled porous structure helps provide uniform suction, while the SiC material offers good thermal stability, chemical resistance, and long service life in demanding equipment. Functional Features:The porous SiC ceramic sucker provides controlled porosity, good air permeability, high temperature resistance, chemical stability, and reliable mechanical strength. It is suitable for precision vacuum holding, wafer transfer, and clean process environments where flatness, adsorption stability, and surface quality are important. Application Industries:This component is mainly used in semiconductor ceramic parts, wafer handling systems, vacuum adsorption equipment, LED production, solar cell manufacturing, microelectronics assembly, and other precision ceramic components applications. Delivery Time:Typical lead time depends on product size, pore structure, surface finish, tolerance requirements, and order quantity. Custom porous SiC ceramic parts can be evaluated according to drawings, samples, or application requirements before production.

Material System:SSiC / RBSiC / Optional CVD SiC Coating Key Properties:High stiffness, low thermal expansion, good thermal conductivity, precision flatness control, and low-contamination surface options. Applications:Wafer handling and support, CVD/LPCVD equipment, diffusion furnaces, high-temperature thermal processing, and semiconductor process equipment. Processing Focus:Deformation control for large or thin-wall structures, precision flatness of critical support surfaces, controlled wafer-contact surface finishing, and prevention of chipping and microcracks during SiC machining. Manufacturing Process:Material Preparation → Forming / Sintering → Precision Machining → Grinding / Polishing → Dimensional & Flatness Inspection → Cleaning & Packaging Typical Lead Time:35–45 Days Customization:Tray dimensions, support geometry, holes, slots, flatness, and surface requirements can be customized according to customer drawings. Engineering prototypes, small-batch qualification, and repeat production are supported.

Product Material:Aluminum Nitride (AlN) Ceramic Material Characteristics:High thermal conductivity for rapid heat dissipation, excellent electrical insulation, low thermal expansion matching semiconductor materials, high temperature stability up to 1800℃, strong chemical inertness, smooth surface suitable for precision vacuum adsorption Application Fields:High-temperature electronic component gripping, semiconductor manufacturing vacuum holding, LED chip and power module positioning, precision microelectronic workpiece clamping Application Industries:Semiconductor manufacturing, LED lighting and packaging, power electronics, aerospace electronics, precision machinery and microelectronic systems Delivery Period:Standard specifications: 15–25 days, customized specifications: 20–35 daysThe insulating and thermally conductive vacuum chuck made from high-purity aluminum nitride ceramic offers precise microelectronic positioning. Ideal for industrial applications requiring reliable heat dissipation and electrical insulation with customizable options from an experienced aluminum nitride ceramic manufacturer.

Product Name: Semiconductor Porous Silicon Carbide Ceramic Sucker Product Material: Porous Silicon Carbide Ceramic Material Characteristics:Adjustable porosity, High temperature resistance, Excellent thermal shock resistance, Good mechanical strength, Outstanding corrosion resistance Application Fields:Semiconductor wafer handling, Vacuum chuck systems, High-temperature processing, Precision manufacturing Application Industries:Semiconductor manufacturing, Electronic components production, Precision instrumentation, Solar cell production Processing Difficulties:Precise porosity control, Uniform pore distribution, Maintaining dimensional stability, Achieving surface flatness, Preventing micro-cracks Processing Flow:Powder preparation → Additive mixing → Forming → Sintering → Precision machining → Surface treatment → Quality inspection → Cleaning and packaging Delivery Period:30-45 days

Product Material:Biomedical Grade High-Purity Alumina Ceramic (Al₂O₃ ≥99.6%). For critical moving and sealing pairs such as valve cores and seats, Zirconia Toughened Alumina (ZTA) can be employed to enhance fracture toughness and wear life. Material Characteristics:Exceptional biocompatibility and hemocompatibility (complying with standards such as ISO 10993), Excellent chemical inertness (resistant to body fluids, blood, cleaning agents, and common disinfectants), High hardness and superior wear resistance, Very high dimensional stability, Good electrical insulation, Surface capable of achieving ultra-high smoothness (Ra < 0.1 µm) to reduce blood adhesion and turbulence, Material is pure and non-toxic with no risk of metal ion or organic leaching, Can withstand autoclave sterilization (high-temperature, high-pressure). Application Fields:Precise dispensing, switching, and mixing valves for blood/reagents in in-vitro diagnostic (IVD) equipment (e.g., biochemical analyzers, chemiluminescence immunoanalyzers, hematology analyzers); Ultra-pure water circuit control valves in hemodialysis equipment; Sterile fluid control valves in cell therapy or biopharmaceutical processes; Miniaturized integrated microfluidic valve chips in point-of-care testing (POCT) devices. Application Industries:Biomedical (In-vitro Diagnostics, Blood Purification, Biopharmaceuticals), Medical Device Manufacturing. Delivery Period:Standard design, biocompatibility-validated valve components: 80-120 daysNewly designed, structurally complex, or custom valves requiring full biosafety evaluation: 150-240 days